Teledyne FLIR BFS-U3-123S6M-C
Teledyne FLIR BFS-U3-123S6M-C: 12.3 MP, 30 FPS, Sony IMX253, Monochrome Camera
Teledyne FLIR BFS-U3-123S6M-C: 12.3 MP, 30 FPS, Sony IMX253, Monochrome Camera
Part NumberBFS-U3-123S6M-C
Resolution4096 × 3000
Frame Rate30
Megapixels12.3
ChromaMono
Sensor NameSony IMX253
Sensor TypeCMOS
Sensor Format1.1"
Readout MethodGlobal shutter
Pixel Size3.45
Lens MountC-mount
ADC10-bit, 12-bit
Required AccessoriesLens, Cable, Host Adapter (USB 3.1 Gen 1), Tripod Mount Adapter (ACC-01-0003)
Features
Acquisition ModesContinuous Single Frame Multi Frame
Exposure Range10 µs to 30 seconds
Flash Memory6 MB non-volatile memory
Frame Rate30
Gain Range0 db to 47 dB
Image Buffer240 MB
Image ProcessingGamma, lookup table, and sharpness
Partial Image ModesPixel binning, decimation, ROI
User Sets2 user configuration sets for custom camera settings
Performance
Absolute Sensitivity Threshold (y)4.43
Dynamic Range dB71.30
Quantum Efficiency63.3 (530nm)
Saturation Capacity (e-)10287
Temporal Dark Noise (e-)2.30
Physical
ADC10-bit, 12-bit
Auxiliary Output3.3 V, 120 mA maximum
ChromaMono
Dimensions [W x H x L]29 mm × 29 mm × 30 mm
InterfaceUSB 3.1 Gen 1
Lens MountC-mount
Mass36 grams
Megapixels12.3
Non-isolated I/O Ports1 bi-directional, 1 input
Operating Humidity20 to 80% (no condensation)
Operating Temperature0° to 50°C
Opto-isolated I/O Ports1 input, 1 output
Part NumberBFS-U3-123S6M-C
Pixel Size3.45
Power Requirements8-24 V via GPIO or 5 V via USB3
Readout MethodGlobal shutter
Resolution4096 × 3000
Sensor Format1.1"
Sensor NameSony IMX253
Sensor TypeCMOS
Storage Humidity30 to 95% (no condensation)
Storage Temperature-30° to 60°C
Lead Times Vary, subject to existing open orders & stock availability.
Full Manufacturer Warranty
Contact us>> for special pricing over 5 pieces.
Features~
Choice of CMOS global shutter, polarization, and high-sensitivity BSI sensors. Color transformation tools ensure true- to-life color. Advanced auto-algorithms or precise manual control.
Support for a wide range of operating systems and host system hardware architectures. Easily switch to board level models for embedded systems. Simplified product iteration with consistent form factor across sensor sizes.
Compatible with third party software and hardware. Less code-writing required using powerful on-camera features. Quickly build custom applications with rich sample code and descriptive API logging.